Supporting unit and substrate treating apparatus including the same

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United States of America Patent

PATENT NO 9909197
SERIAL NO

14974023

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Abstract

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A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ha, Kang Rae Hwasun-gun, KR 3 13
Lee, Wonhaeng Cheonan-si, KR 4 24

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