Multi-sensor assembly with tempature sensors having different thermal profiles
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United States of America Patent
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Mar 6, 2018
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app pub date -
Feb 24, 2015
filing date -
Feb 24, 2015
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Abstract
One example discloses a multi-sensor assembly, comprising: a first temperature sensor, having a first thermal profile; a second temperature sensor, having a second thermal profile different from the first thermal profile; wherein the first and second temperature sensors are mounted on a set of lead-frames; wherein the first and second temperature sensors include a first heat path input coupled to an ambient environment, and a second heat path input coupled to at least one of the lead-frames; and wherein the first and second sensors and set of lead-frames are included in a single multi-sensor assembly. Another example discloses a method of manufacture for the multi-sensor assembly.
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