Method of patterning thin films

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United States of America Patent

PATENT NO 9910356
SERIAL NO

14894699

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Abstract

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A method of patterning a thin film is provided. The method includes coating a thin film layer and photoresist on a surface of a substrate; forming a first partially cured zone by performing a first exposing process of the photoresist with a mask, wherein exposing energy applied to the photoresist of the first partially cured zone is less than a photosensitive threshold of the photoresist; forming a cured zone on the first partially cured zone by performing a second exposing process of the photoresist with the mask, wherein a width of the cured zone is less than a width of the first partially cured zone, and exposing energy applied to the photoresist of the cured zone is equal to or greater than the photosensitive threshold of the photoresist; developing the photoresist; etching the thin film layer that is not covered by the photoresist; and removing the photoresist of the cured zone.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTDNO 10 JIUXIANQIAO RD CHAOYANG DISTRICT BEIJING 100015
HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO LTD230012 NO 2177 NORTH TONGLING ROAD HEFEI ANHUI HEFEI CITY ANHUI PROVINCE 230012

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guo, Jianqiang Beijing, CN 4 3
Liao, Honglin Beijing, CN 1 0
Luo, Zhuyi Beijing, CN 3 1
Meng, Xiangming Beijing, CN 4 0
Youn, Jinho Beijing, CN 7 1
Zhang, Lei Beijing, CN 1288 8910

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