Semiconductor device leadframe

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9911628
SERIAL NO

15392947

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

For so called film assisted molding (FAM) device processing techniques there is provided lead frame for a semiconductor device, comprising a base portion and a connection lead, said base portion arranged for mounting a semiconductor die, said connection lead comprising a horizontal portion for external connection and an angled portion for connection to said semiconductor die, wherein the angled portion has a positive angle with respect to the base portion. The connection lead may comprise a recessed portion.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
AMPLEON NETHERLANDS B V6534 AV NIJMEGEN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Incomio, Jeremy Joy Montalbo Santa Rosa, PH 3 0
Reijs, Albertus Molenhoek, NL 4 0
van, Straten Freek Egbert Mook, NL 12 137

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 6, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 6, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00