Process for making and using mesh-style NCEM pads

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United States of America Patent

PATENT NO 9911649
SERIAL NO

15259309

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Abstract

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Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, and may include NCEM pads that comprise a mesh of GATECNT and AACNT stripes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).

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Patent Owner(s)

  • PDF SOLUTIONS, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brozek, Tomasz Morgan Hill, US 87 285
Cheng, Jeremy San Jose, US 117 290
Ciplickas, Dennis San Jose, US 88 366
Comensoli, Simone Darfo Boario Terme, IT 80 96
De, Indranil Mountain View, US 118 981
Doong, Kelvin Hsinchu, TW 81 177
Eisenmann, Hans Tutzing, DE 85 143
Fiscus, Timothy New Galilee, US 81 105
Haigh, Jonathan Pittsburgh, US 98 217
Hess, Christopher Belmont, US 123 1303
Kibarian, John Los Altos Hills, US 89 528
Lam, Stephen Freemont, US 123 1959
Lee, Sherry Monte Sereno, US 88 368
Liao, Marci Santa Clara, US 80 96
Lin, Sheng-Che Hsinchu, TW 86 96
Matsuhashi, Hideki Santa Clara, US 84 133
Michaels, Kimon Monte Sereno, US 88 271
O'Sullivan, Conor Campbell, US 93 243
Rauscher, Markus Munich, DE 89 820
Rovner, Vyacheslav Pittsburgh, US 80 96
Strojwas, Andrzej Pittsburgh, US 81 114
Strojwas, Marcin Pittsburgh, US 80 96
Taylor, Carl Pittsburgh, US 90 1035
Vallishayee, Rakesh Dublin, US 83 345
Weiland, Larg Hollister, US 81 96
Yokoyama, Nobuharu Tokyo, JP 80 96

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