Process for making and using mesh-style NCEM pads

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United States of America Patent

PATENT NO 9911649
SERIAL NO

15259309

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Abstract

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Wafers, chips, or dies that contain fill cells with structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). Such NCEM-enabled fill cells may target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, and may include NCEM pads that comprise a mesh of GATECNT and AACNT stripes. Such wafers, chips, or dies may include Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).

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Patent Owner(s)

Patent OwnerAddress
PDF SOLUTIONS INC2858 DE LA CRUZ BOULEVARD SANTA CLARA CA 95050

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brozek, Tomasz Morgan Hill, US 87 297
Cheng, Jeremy San Jose, US 119 311
Ciplickas, Dennis San Jose, US 89 381
Comensoli, Simone Darfo Boario Terme, IT 80 105
De, Indranil Mountain View, US 120 1081
Doong, Kelvin Hsinchu, TW 81 186
Eisenmann, Hans Tutzing, DE 86 154
Fiscus, Timothy New Galilee, US 81 114
Haigh, Jonathan Pittsburgh, US 98 229
Hess, Christopher Belmont, US 125 1363
Kibarian, John Los Altos Hills, US 89 539
Lam, Stephen Freemont, US 127 2094
Lee, Sherry Monte Sereno, US 88 398
Liao, Marci Santa Clara, US 80 105
Lin, Sheng-Che Hsinchu, TW 86 105
Matsuhashi, Hideki Santa Clara, US 84 142
Michaels, Kimon Monte Sereno, US 88 280
O'Sullivan, Conor Campbell, US 93 266
Rauscher, Markus Munich, DE 90 914
Rovner, Vyacheslav Pittsburgh, US 80 105
Strojwas, Andrzej Pittsburgh, US 81 124
Strojwas, Marcin Pittsburgh, US 80 105
Taylor, Carl Pittsburgh, US 90 1069
Vallishayee, Rakesh Dublin, US 83 357
Weiland, Larg Hollister, US 81 105
Yokoyama, Nobuharu Tokyo, JP 80 105

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