Integrated circuit including NCEM-enabled, diagonal gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates

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United States of America Patent

PATENT NO 9911669
SERIAL NO

15719604

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Abstract

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An integrated circuit, in the form of a wafer, die, or chip, includes multiple standard cell-compatible fill cells, configured to enable non-contact electrical measurements. Such fill cells include mesh pads that contain at least three conductive stripes disposed between adjacent gate stripes. Such fill cells further include geometry to enable non-contact evaluation of diagonal shorts and/or leakages.

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Patent Owner(s)

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PDF SOLUTIONS INC2858 DE LA CRUZ BOULEVARD SANTA CLARA CA 95050

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brozek, Tomasz Morgan Hill, US 87 297
Cheng, Jeremy San Jose, US 119 311
Ciplickas, Dennis San Jose, US 89 381
Comensoli, Simone Darfo Boario Terme, IT 80 105
De, Indranil Mountain View, US 120 1081
Doong, Kelvin Hsinchu, TW 81 186
Eisenmann, Hans Tutzing, DE 86 154
Fiscus, Timothy New Galilee, US 81 114
Haigh, Jonathan Pittsburgh, US 98 229
Hess, Christopher Belmont, US 125 1363
Kibarian, John Los Altos Hills, US 89 539
Lam, Stephen Freemont, US 127 2094
Lee, Sherry Monte Sereno, US 88 398
Liao, Marci Santa Clara, US 80 105
Lin, Sheng-Che Hsinchu, TW 86 105
Matsuhashi, Hideki Santa Clara, US 84 142
Michaels, Kimon Monte Sereno, US 88 280
O'Sullivan, Conor Campbell, US 93 266
Rauscher, Markus Munich, DE 90 914
Rovner, Vyacheslav Pittsburgh, US 80 105
Strojwas, Andrzej Pittsburgh, US 81 124
Strojwas, Marcin Pittsburgh, US 80 105
Taylor, Carl Pittsburgh, US 90 1069
Vallishayee, Rakesh Dublin, US 83 357
Weiland, Larg Hollister, US 81 105
Yokoyama, Nobuharu Tokyo, JP 80 105

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