Bidirectional semiconductor package

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United States of America Patent

PATENT NO 9911680
SERIAL NO

15470648

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Abstract

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Provided is a bidirectional semiconductor package in which the number of processes for manufacturing the bidirectional semiconductor package is reduced. According to present application, a portion between one end and the other end of the buffer wire is in contact with the lower surface of the upper DBC substrate and heat generated by the semiconductor chip is transferred to the upper DBC substrate.

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Patent Owner(s)

Patent OwnerAddress
HYUNDAI MOBIS CO LTD203 TEHERAN-RO GANGNAM-GU SEOUL 06141

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ko, Jae Hyun Yongin-si, KR 6 5

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