Land structure for semiconductor package and method therefor
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Feb 14, 2016
filing date -
Nov 9, 2012
priority date (Note) -
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Abstract
In one embodiment, a method for forming a package substrate includes selectively removing portions of a lead frame to form cavities and filling the cavities with a resin layer to define an adhesion pad and a land structure. Top portions of the lead frame are selectively removed to isolate the adhesion pad and the land structure from each other, to expose a top surface of the resin layer, and to form at least one land having a part with a relatively greater size than the size of a respective lower part.
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