Methods of making stackable wiring board having electronic component in dielectric recess
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Dec 3, 2015
filing date -
Jul 28, 2015
priority date (Note) -
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Abstract
A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. An array of metal posts that provide vertical electrical connections are formed by using the same metal carrier that forms the recess, so that the predetermined distance and relative location between metal posts and pads/bumps of the electronic component can be maintained.
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