Prepreg, metal foil-clad laminate, and printed wiring board

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United States of America Patent

PATENT NO 9914662
SERIAL NO

14007817

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Importance

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Abstract

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A prepreg having low water absorption, and having remarkably suppressed deterioration in insulation resistance over time, and further having excellent heat resistance, a metal foil-clad laminate using the prepreg, and a printed wiring board using the metal foil-clad laminate are provided. A prepreg of the present invention is obtained by impregnating or coating a base material (D) with a resin composition comprising: a naphthol-modified dimethylnaphthalene formaldehyde resin (A); an epoxy resin (B) having an epoxy equivalent of 200 to 400 g/eq.; and an inorganic filler (C).

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Patent Owner(s)

  • MITSUBISHI GAS CHEMICAL COMPANY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arii, Kenj Tokyo, JP 2 7
Nomizu, Kentaro Tokyo, JP 4 7
Sogame, Masanobu Tokyo, JP 19 96

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