Slurry composition and method for polishing substrate

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United States of America Patent

PATENT NO 9914853
SERIAL NO

15126543

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Abstract

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Provided are a slurry composition to be used in chemical mechanical polishing (CMP), and a method for polishing a substrate. This slurry composition contains water, abrasive grains, and an alkylene polyalkylene oxide amine polymer having a solubility parameter in a range of 9-10. A preferred alkylene polyalkylene oxide amine polymer is given by general formula (1). (In general formula (1), m and n are positive integers, and A and R are alkylene oxide groups.)

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Patent Owner(s)

Patent OwnerAddress
ENTEGRIS INC129 CONCORD ROAD BILLERICA MA 01821

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kitamura, Hiroshi Tsu, JP 86 1057
Masuda, Tsuyoshi Tsu, JP 49 329
Matsumura, Yoshiyuki Tsu, JP 49 414

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