Low application temperature hot melt adhesive

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United States of America Patent

PATENT NO 9914857
SERIAL NO

14804797

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Abstract

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The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeJesus, Maria Cristina Barbosa Basking Ridge, US 11 29
Hu, Yuhong Belle Mead, US 23 108
Pollock-Downer, Alethea Franklin Park, US 4 29
Sharak, Matthew Franklin Park, US 5 78
Xenidou, Maria Flemington, US 11 58

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