Laser ablation and processing methods and systems
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United States of America Patent
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Mar 13, 2018
Issued Date -
N/A
app pub date -
Dec 24, 2014
filing date -
Sep 9, 2014
priority date (Note) -
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Abstract
Systems and methods for ablating or processing a surface using a laser beam are provided. A method includes directing a laser beam at a surface to form a contact area. The method also includes moving the contact area to form a contact curve. The method includes tuning a wavelength and a power of the laser beam to process a material and/or ablate a coating. The wavelength and the power may be further tuned to not damage the surface beneath the coating. Moving the contact area may include forming a second contact curve by superimposing, at a same time, the second contact curve on the contact curve. A system includes a laser and a directing arrangement configured to direct a laser beam from the laser at a surface to form a contact area. A non-transitory processor-readable medium having instructions stored thereon is provided.
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