Method and an apparatus for depositing a layer onto a workpiece using plasma

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United States of America Patent

PATENT NO 9915000
SERIAL NO

14401078

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Various embodiments relate a method for depositing a layer onto a workpiece using plasma. The method comprises arranging the workpiece and a source material inside a vacuum chamber. The method also comprises applying energy to the source material to cause atoms of the source material to be ejected from a surface of the source material into a plasma. The method further comprises orientating the workpiece with respect to the source material to prevent direct propagation of the ejected atoms from the source material to a work surface of the workpiece and to permit deposition of the layer onto the workpiece by ejected atoms which impact the work surface after colliding with particles of the plasma. Various embodiments also provide a corresponding apparatus.

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Patent Owner(s)

  • NATIONAL UNIVERSITY OF SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Qiu, Xuepeng Singapore, SG 11 82
Shin, Young Jun Singapore, SG 22 279
Yang, Hyunsoo Singapore, SG 19 92

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