Creation of cut files to fit a large package flat on one or more substrates
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United States of America Patent
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Mar 13, 2018
Issued Date -
N/A
app pub date -
May 18, 2015
filing date -
May 18, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A package design system creates one or more package design files by creating cut line instructions and fold line instructions for a package flat. If the system determines that the package flat should be split into two or more subparts across two or more substrates or two or more sub-regions of a single substrate, it will select a fold line and convert the selected fold line to a seam. Conversion to a seam may occur by creating cut line instructions for the selected fold line, imparting a first set of functional elements on a first side of the seam, and imparting a second set of functional elements on a second side of the seam. The first set of functional elements and the second set of functional elements will form a functional connection when the three-dimensional structure is formed.
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