Detection of defects embedded in noise for inspection in semiconductor manufacturing
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United States of America Patent
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Mar 13, 2018
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app pub date -
Jun 27, 2012
filing date -
Jun 27, 2012
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Abstract
One embodiment relates to an apparatus for detecting defects on a manufactured substrate. The apparatus includes an imaging tool arranged to obtain image frames from the manufactured substrate. The apparatus further includes a data processing system which includes computer-readable code configured to compute features for pixels in an image frame and divide the pixels in the image frame into feature-defined groups of pixels. The computer-readable code is further configured to select a feature-defined group, and generate a multi-dimensional feature distribution for the selected feature-defined group. Another embodiment relates to a method of detecting defects from a test images frame and multiple reference image frames. Other embodiments, aspects, and features are also disclosed.
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