Method for detecting a thinning of the semiconductor substrate of an integrated circuit from its back face and corresponding integrated circuit

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United States of America Patent

PATENT NO 9916902
SERIAL NO

15218261

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Abstract

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The thinning of a semiconductor substrate of an integrated circuit from a back face is detected using the measurement of a physical quantity representative of the resistance between the ends of two electrically-conducting contacts situated at an interface between an insulating region and an underlying substrate region. The two electrically-conducting contacts extend through the insulating region to reach the underlying substrate region.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS (ROUSSET) SASZI DE PEYNIER-ROUSSET AVENUE COQ ROUSSET 13790

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fornara, Pascal Pourrieres, FR 115 341
Rivero, Christian Rousset, FR 83 289

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