System and method for laser assisted bonding of semiconductor die

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United States of America Patent

PATENT NO 9916989
SERIAL NO

15130637

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Abstract

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A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

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Patent Owner(s)

  • AMKOR TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Yang Gyoo Seoul, KR 9 43
Kim, Choong Hoe Seoul, KR 10 36
Kim, Min Ho Seoul, KR 111 767
Ryu, Dong Soo Seongnam-si, KR 10 84
Song, Youn Seok Gwangju, KR 6 27
Yoon, Tae Ho Daejeon, KR 21 753

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