Systems and methods for flexible components for powered cards and devices

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United States of America Patent

PATENT NO 9916992
SERIAL NO

13770484

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The flexible die may be applied to a mechanical carrier (e.g., a PCB) of a card or device. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. Such detection circuitry may cause a reaction to the changed characteristics by controlling other components on the card or device based upon the flex-induced changed characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device.

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Patent Owner(s)

  • DYNAMICS INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mullen, Jeffrey D Pittsburgh, US 280 21736
O'Shea, Norman E Seven Fields, US 12 255

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