Electronic component and method for electrically coupling a semiconductor die to a contact pad
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United States of America Patent
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Mar 13, 2018
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N/A
app pub date -
Jul 14, 2016
filing date -
Jul 7, 2014
priority date (Note) -
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Abstract
In an embodiment, an electronic component includes a dielectric core layer, one or semiconductor dies comprising a first major surface, a first electrode arranged on the first major surface and a second major surface that opposes the first major surface. One or more slots are arranged within the dielectric core layer adjacent the semiconductor die and a redistribution structure electrically couples the first electrode to a component contact pad arranged adjacent the second major surface of the semiconductor die. The semiconductor die is embedded in the dielectric core layer and a portion of the redistribution structure is arranged on side walls of the slot.
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