Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package
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United States of America Patent
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Mar 13, 2018
Issued Date -
N/A
app pub date -
Jun 29, 2016
filing date -
Jul 31, 2012
priority date (Note) -
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Abstract
A microelectronic package includes first and second encapsulated microelectronic elements, each of which includes a semiconductor die having a front face and contacts thereon. An encapsulant contacts at least an edge surface of each semiconductor die and extends in at least one lateral direction therefrom. Electrically conductive elements extend from the contacts and over the front face to locations overlying the encapsulant. The first and second microelectronic elements are affixed to one another such that one of the front or back surfaces of one of the first and second semiconductor dies is oriented towards one of the front or back surfaces of the other of the first and second semiconductor dies. A plurality of electrically conductive interconnects extend through the encapsulants of the first and second microelectronic elements and are electrically connected with at least one semiconductor die of the first and second microelectronic elements by the conductive elements.
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