Wiring substrate
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United States of America Patent
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Mar 13, 2018
Issued Date -
N/A
app pub date -
Oct 16, 2017
filing date -
Nov 18, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A wiring substrate includes a wiring layer, an insulating layer covering the wiring layer, and a protruding electrode including a protruding metal layer and a surface metal layer. The protruding metal layer is connected to the wiring layer in an opening of the insulating layer, extends from within the opening to be stepped at the edge of the opening to extend outward onto the insulating layer, and includes a first surface contacting a surface of the insulating layer around the opening, a second surface, and a peripheral surface extending between the first and second surfaces, and bent inward to form a space between the peripheral surface and the surface of the insulating layer. The surface metal layer covers the protruding metal layer without contacting the surface of the insulating layer, and is formed of a metal having a lower melting point than the protruding metal layer.
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