Substrate aligning apparatus, substrate bonding apparatus, substrate aligning method and substrate bonding method

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United States of America Patent

PATENT NO 9919508
SERIAL NO

14695621

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Abstract

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A substrate aligning apparatus comprising: an aligning section that aligns a first substrate and a second substrate together; an acquiring section that acquires positional information on at least one of the first substrate and the second substrate, by the time the first substrate and the second substrate which have been aligned in the aligning section are carried out from the aligning section; a judging that judges misalignment of the first substrate and the second substrate, based on information acquired by the acquiring section.

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Patent Owner(s)

  • NIKON CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Okamoto, Kazuya Yokohama, JP 167 3097
Sugaya, Isao Kawasaki, JP 50 228

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