Peeling device, peeling system and peeling method
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Dec 16, 2011
filing date -
Jan 7, 2011
priority date (Note) -
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Abstract
A peeling device for peeling off a substrate to be processed and a support substrate from an overlapped substrate, the overlapped substrate being formed by bonding the substrate to be processed and the support substrate by an adhesive, which includes: a first holding unit configured to heat the substrate to be processed and configured to hold the substrate to be processed; a second holding unit configured to heat the support substrate and configured to hold the support substrate; a moving mechanism configured to horizontally move at least one of the first holding unit and the second holding unit relative to each other; and an inert gas supply mechanism configured to supply an inert gas onto a bonding surface of the substrate to be processed or a bonding surface of the support substrate.
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