Wafer-level bonding packaging method and wafer structure

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United States of America Patent

PATENT NO 9919918
SERIAL NO

15214108

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a wafer-level bonding packaging method, including: providing a plurality of first wafers and a plurality of second wafers, a to-be-bonded surface of a first wafer being a first to-be-bonded surface, a to-be-bonded surface of a second wafer being a second to-be-bonded surface, and the first to-be-bonded surface including a first region and a second region; forming at least one first bonding structure on the second region; forming at least one second bonding structure on a second to-be-bonded surface, the at least one second bonding structure corresponding to the at least one first bonding structure; and forming a supporting layer on the first region, a height of supporting layer being greater than a height of the first bonding structure and less than a sum of the height of the first bonding structure and a height of the second bonding structure.

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Patent Owner(s)

  • SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION;SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Xu, Wei Shanghai, CN 846 7441

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