Systems and methods for mask reduction techniques

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United States of America Patent

PATENT NO 9919920
SERIAL NO

15455877

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Abstract

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Systems and methods are provided for fabricating a microelectromechanical system (MEMS) sensor system. A first conductive layer is provided over a pad. A second conductive layer is provided over the pad, over an outgassing layer, and over a conductive bump stop structure. A first etch is performed to remove a portion of the second conductive layer over the pad. A second etch is performed, using a single mask, to remove a portion of the first conductive layer over the pad and to remove the second conductive layer over the outgassing layer.

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Patent Owner(s)

Patent OwnerAddress
INVENSENSE INC1745 TECHNOLOGY DRIVE SUITE 200 SAN JOSE CA 95110

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Daesung San Jose, US 160 2240

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