Leveling composition and method for electrodeposition of metals in microelectronics

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United States of America Patent

PATENT NO 9920023
SERIAL NO

15388927

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Abstract

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The present disclosure relates to a leveling composition for electrodepositing metals. The composition comprises a compound of formula (I):

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Patent Owner(s)

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SUZHOU SHINHAO MATERIALS LLC2358 CHANGAN ROAD WUJIANG SUZHOU JIANGSU 215200

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dong, Peipei Wujiang, CN 10 7
Ma, Tao Wujiang, CN 221 973
Zhang, Yun Warren, US 273 1506

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