Thermal compound composition containing Cu—CuO composite filler

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United States of America Patent

PATENT NO 9920231
SERIAL NO

15458648

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Abstract

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Provided is a thermal compound composition having heat dissipation and electrical insulation properties, where the thermal compound composition includes a Cu—CuO composite filler having a Cu core and a shell composed of CuO having a whisker crystal structure. The CuO having the whisker crystal structure is prepared by reacting Cu particles in a basic solution so that an outer shell thereof is grown into whisker-shaped CuO.

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Patent Owner(s)

Patent OwnerAddress
YOUNGYIEL PRECISION CO LTD132 BEOTKKOT-RO GEUMCHEON-GU SEOUL

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Dong-Wook Seoul, KR 1 0
Chu, Jae-Uk Seoul, KR 6 201
Lee, Dong-Woo Seoul, KR 109 1278
Um, Chang-Hyun Seoul, KR 1 0

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