Film deposition method

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United States of America Patent

PATENT NO 9920428
APP PUB NO 20160194757A1
SERIAL NO

14965367

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A film deposition apparatus includes: a plasma generating section configured to generate plasma between a cathode target and an anode; a film deposition chamber in which a base material is placed; and a magnetic-field filter section configured to remove a particle from the plasma by a magnetic field and to transfer the plasma to the film deposition chamber. The magnetic-field filter section includes: a first housing area to which a first voltage is applied; and a second housing area, provided downstream of the first housing area in the moving direction of the plasma, to which a second voltage is applied.

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Patent Owner(s)

  • FUJITSU LIMITED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiba, Hiroshi Kawasaki, JP 118 1593
Miyahara, Shoichi Kawasaki, JP 11 48
Nakamura, Norikazu Kawasaki, JP 63 817

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