Adhesion promoting agents for metallization of substrate surfaces

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United States of America Patent

PATENT NO 9920432
SERIAL NO

14362604

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Abstract

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A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

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Patent Owner(s)

  • ATOTECH DEUTSCHLAND GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brandt, Lutz Englewood, US 12 200
Schreier, Hans-Jürgen Velten, DE 4 11
Stamp, Lutz Berlin, DE 10 74
Thomas, Thomas Berlin, DE 15 839

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