Semiconductive resin composition, member for electrophotography and image forming apparatus

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United States of America Patent

PATENT NO 9921526
SERIAL NO

14967827

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Abstract

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A semiconductive resin composition includes at least two thermoplastic resins and a conductive filler. Each of the two thermoplastic resins has a sea-island structure, and 40% to 75% of the conductive filler are present in the thermoplastic resin in an island portion of the sea-island structure at an areal ratio of a cross section observed with a scanning electron microscope.

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Patent Owner(s)

Patent OwnerAddress
RICOH COMPANY LTDTOKYO 143-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haga, Yuri Kanagawa, JP 9 45
Izutani, Akira Osaka, JP 36 320
Juri, Keiichiro Kanagawa, JP 28 147
Matsushita, Makoto Tokyo, JP 118 577
Momose, Ayano Tokyo, JP 9 60
Takahashi, Hiroaki Kanagawa, JP 436 3274
Yasunaga, Hideaki Tokyo, JP 59 1207

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