Ceramic electronic component and manufacturing method therefor
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United States of America Patent
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Mar 20, 2018
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N/A
app pub date -
Sep 18, 2015
filing date -
Sep 30, 2014
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Abstract
A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes.
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