Sputtering target and method for production thereof

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United States of America Patent

PATENT NO 9922807
SERIAL NO

14896522

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Abstract

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A sputtering target according to the disclosure includes 5 wtppm to 10,000 wtppm of Cu and the balance of In and has a relative density of 99% or more and an average grain size of 3,000 μm or less.

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Patent Owner(s)

  • JX NIPPON MINING & METALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Endo, Yousuke Ibaraki, JP 9 57

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