Semiconductor device

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United States of America Patent

PATENT NO 9922905
SERIAL NO

15444773

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Abstract

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A semiconductor device according to an embodiment is a semiconductor device in which a semiconductor chip mounted on a chip mounting part is sealed by resin and a first member is fixed to a chip mounting surface side between a peripheral portion of the semiconductor chip and a peripheral portion of the chip mounting part. Also, the first member is sealed by the resin. Also, a length of the first part of the chip mounting part in the first direction is larger than a length of the semiconductor chip in the first direction, in a plan view.

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Patent Owner(s)

Patent OwnerAddress
RENESAS ELECTRONICS CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oka, Hiroi Tokyo, JP 26 417
Okunishi, Noriko Tokyo, JP 5 17
Takada, Keita Tokyo, JP 14 74
Yato, Yuichi Tokyo, JP 13 154

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