Electronic component, leadframe, and method for producing an electronic component
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United States of America Patent
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Mar 20, 2018
Issued Date -
N/A
app pub date -
Jul 14, 2015
filing date -
Jul 17, 2014
priority date (Note) -
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Abstract
An electronic component, a leadframe, and a method for producing an electronic component are disclosed. In an embodiment, the electronic component includes a housing and a leadframe section partly embedded in the housing, wherein the leadframe section includes a first quadrant, a second quadrant, a third quadrant and a fourth quadrant, wherein each of the quadrants has a first leadframe part and a second leadframe part, wherein each first leadframe part includes a chip landing area, wherein the chip landing areas of all four quadrants are arranged adjacently to a common central region of the leadframe section, and wherein the four quadrants are configured symmetrically with respect to one another.
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