Semiconductor package having a leadframe with multi-level assembly pads
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United States of America Patent
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Mar 20, 2018
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app pub date -
Dec 18, 2015
filing date -
Dec 18, 2015
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Abstract
A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (133) to the second pad.
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