Functionalized interface structure

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United States of America Patent

PATENT NO 9922910
SERIAL NO

15272037

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic component, the electronic component comprising an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating part of the carrier and the electronic chip, and an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier and a connected surface portion of the encapsulant and being functionalized for promoting heat dissipation via the interface structure on a heat dissipation body.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AUSTRIA AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fuergut, Edward Dasing, DE 159 1971
Kasztelan, Christian München, DE 14 58
Kuek, Hsieh Ting Melaka, MY 4 19
Lee, Teck Sim Melaka, MY 39 173
Murugan, Sanjay Kumar Melaka, MY 12 24
Otremba, Ralf Kaufbeuren, DE 279 3040
Wang, Lee Shuang Melaka, MY 16 23

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