Electronic package structure having insulated substrate with lands and conductive patterns
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 20, 2018
Issued Date -
N/A
app pub date -
Dec 30, 2015
filing date -
Mar 20, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In one embodiment, an electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns and a package body encapsulating the top surface of the insulating material and the electronic device, wherein the bottom land surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully