Resin structure having electronic component embedded therein, and method for manufacturing said structure

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United States of America Patent

PATENT NO 9922932
SERIAL NO

15128450

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Abstract

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In a resin structure including a resin molded body and a plurality of electronic components embedded in the resin molded body, (i) the resin molded body has a plurality of exposed surfaces on which electrodes of the plurality of electronic components are exposed, (ii) the resin molded body has a recess formed therein, and (iii) the recess has a bottom surface which is at least one of the plurality of exposed surfaces.

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Patent Owner(s)

  • OMRON CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawai, Wakahiro Konan, JP 46 747

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