Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

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United States of America Patent

PATENT NO 9922938
SERIAL NO

15257723

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Abstract

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The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Wei-Yu Kaohsiung, TW 669 4964
Lee, Chun-Chia Kaohsiung, TW 3 263
Li, Huan Wun Kaohsiung, TW 3 269
Tsai, Ming-Horng Kaohsiung, TW 4 262

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