Semiconductor device including air gaps between interconnects and method of manufacturing the same
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United States of America Patent
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Mar 20, 2018
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app pub date -
Aug 22, 2016
filing date -
Feb 22, 2016
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Abstract
A semiconductor device includes a substrate, and interconnects provided above the substrate. The device further includes a first insulator that is provided on the interconnects and on air gaps provided between the interconnects, surrounds the interconnects from lateral sides of the interconnects, and is formed of a first insulating material. The device further includes a second insulator that surrounds an interconnect region including the interconnects and the air gaps from the lateral sides of the interconnects through the first insulator, includes no portion provided between the interconnects, and is formed of a second insulating material different from the first insulating material.
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