Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component

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United States of America Patent

PATENT NO 9922946
SERIAL NO

15480751

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Abstract

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A method of manufacturing a semiconductor device package includes placing a semiconductor chip on a carrier, covering the semiconductor chip with an encapsulation material to form an encapsulation body, providing a microwave component having at least one electrically conducting wall structure integrated in the encapsulation body, and forming an electrical interconnect configured to electrically couple the semiconductor chip and the microwave component.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boeck, Josef Putzbrunn, DE 24 448
Hartner, Walter Bad Abbach, DE 81 695
Seler, Ernst Munich, DE 22 151
Wojnowski, Maciej Munich, DE 44 756

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