Process for producing a structure by assembling at least two elements by direct adhesive bonding
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United States of America Patent
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Mar 20, 2018
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app pub date -
Feb 26, 2015
filing date -
Feb 27, 2014
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Abstract
A method for producing a structure by direct bonding of two elements, the method including: production of the elements to be assembled and assembly of the elements. The production of the elements to be assembled includes: deposition on a substrate of a TiN layer by physical vapor deposition, and deposition of a copper layer on the TiN layer. The assembly of the elements includes: polishing the surfaces of the copper layers intended to come into contact so that they have a roughness of less than 1 nm RMS and hydrophilic properties, bringing the surfaces into contact, and storing the structure at atmospheric pressure and at ambient temperature.
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