Packaging structure of substrates connected by metal terminals

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United States of America Patent

PATENT NO 9922960
SERIAL NO

15196170

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Abstract

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A packaging structure includes a first substrate including a first metal terminal and a second metal terminal whose height is lower than the height of the first metal terminal; and a second substrate including a third metal terminal and a fourth metal terminal whose height is lower than the height of the third metal terminal, the second substrate being provided on the first substrate, the first metal terminal and the third metal terminal being directly bonded with each other, and the second metal terminal and the fourth metal terminal being bonded via a connection portion.

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Patent Owner(s)

Patent OwnerAddress
SHINKO ELECTRIC INDUSTRIES CO LTD80 OSHIMADA-MACHI NAGANO SHI NAGANO KEN 381-2287

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Sumihiro Nagano, JP 8 103

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