Method of manufacturing light emitting device with exposed wire end portions

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United States of America Patent

PATENT NO 9923134
SERIAL NO

15169066

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.

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Patent Owner(s)

Patent OwnerAddress
NICHIA CORPORATIONANAN-SHI TOKUSHIMA 774-8601

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aihara, Yoshiyuki Tokushima, JP 20 58
Yoneda, Akinori Anan, JP 41 256

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