Semiconductor module bonding wire connection method
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United States of America Patent
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Mar 27, 2018
Issued Date -
N/A
app pub date -
May 11, 2015
filing date -
May 14, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.
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