Electrical bonding method
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United States of America Patent
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Mar 27, 2018
Issued Date -
N/A
app pub date -
Sep 18, 2015
filing date -
Oct 10, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
To bond bonding target members stacked on top of each other without generating dust or spatter into an electrically bonded article with improved mechanical strength against strong vibration etc. A first bonding target member or second bonding target member includes a relative displacement amount setting portion for setting the distance by which the bonding target portion of the first member and the bonding target portion of the second member are relatively displaced during bonding, and a current conduction suppressing layer is formed on the relative displacement amount setting portion. The second or first member includes a setting face that is placed opposed to the current conduction suppressing layer of the first or second member. In a state where the first and second members have been positioned, the distance between the current conduction suppressing layer and the setting face is equal to the width H of the bonded portion.
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