Process of assembling and repositioning two parts

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United States of America Patent

PATENT NO 9926468
SERIAL NO

15370351

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a process for assembling and repositioning at least two parts by means of a repositionable hot melt adhesive, wherein said parts are held together in assembled position when said adhesive is at a temperature TA and can be repositioned in relation to one another when said adhesive is heated to a temperature TC, wherein said adhesive comprises at least a formulation, which:

    at the temperature TC has the form of a mixture of polymer chains comprising at least pendant diene units X and of coupling molecules comprising at least two dienophile end groups Y, wherein said X units and said Y groups are arranged to be able to react with one another and to bond together by means of the Diels-Alder reaction at a temperature TDA and to be able to regenerate by means of the retro-Diels-Alder reaction at a temperature TRDA,at a temperature TA has the form of a three-dimensional network, in which the polymer chains are linked to one another by the coupling molecules by means of the Diels-Alder reaction, where TA

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Patent Owner(s)

Patent OwnerAddress
THE SWATCH GROUP RESEARCH AND DEVELOPMENT LTD2074 MARIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fernandez, Ciurleo Maria Fleurier, CH 4 14
Rannoux, Claire Lausanne, FR 26 58

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