High-sensitivity sensor comprising conductive thin film containing cracks and method for manufacturing same
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United States of America Patent
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Mar 27, 2018
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Dec 3, 2014
filing date -
Dec 3, 2013
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Abstract
A high-sensitivity sensor containing cracks is provided. The high-sensitivity sensor is obtained by forming microcracks on a conductive thin film, which is formed on top of a support, wherein the microcracks form a micro joining structure in which the microcracks are electrically changed, short-circuited or open, thereby converting external stimuli into electric signals by generating a change in a resistance value. The high-sensitivity sensor can be useful in a displacement sensor, a pressure sensor, a vibration sensor, artificial skin, a voice recognition system, and the like.
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