Method of producing through wiring substrate and method of producing device
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United States of America Patent
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Mar 27, 2018
Issued Date -
N/A
app pub date -
Dec 14, 2016
filing date -
Dec 15, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
In a method of producing a device in which an element structure is provided on a substrate including a through wiring, a through hole is formed so as to extend from a first surface of the substrate to a second surface of the substrate disposed on an opposite side of the substrate to the first surface, the through wiring is formed by filling the through hole with an electrically conductive material, and the element structure is formed on a first surface side. In the step of forming the through hole, a degree of surface irregularities of an inner wall of the through hole is larger on the first surface side than on a second surface side.
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